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Build Your Online Product Catalogs?
�0.4 mm BGA pitch solutions
�Double sided
�Multilayer 1~36
�Microvia & ELIC (Any layer technology)
�Laser Direct Imaging (LDI)/Direct Imaging (DI)
�Via Filling Technology (VIPPO & Cu Filling)
�Coins Technology
�Back Drilling
�UV Plugging �RoHS co***tibility
�Sequential Lamination
�State-of-the-art analytical and reliability lab testing
�15:1 aspect ratio
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| Company: |
Willpower Circuit Technology Co.Ltd
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| Contact: |
Ms. Lisa Li |
| Address: |
Shenzhen,518102,Guangdong Province,China |
| Postcode: |
518102 |
| Tel: |
8675533592868 |
| Fax: |
8675533592869 |
| E-mail: |
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