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Willpower Circuit Technology Co.Ltd
Showing 1 - 5 of 5, total 1 pages [First] [Previous] [Next] [Last]
1
mc-pcb
Specification: 500MM X 630MM
Detail: Layer:1-4L Max Board Size:1.5M Max coppper thickness:10 OZ Min Track Width/***ce:5/6 MIL Finished Thickness: 0.5-3.2MM Suface Treatment: HAL、Immersion Gold、Immersion Silver、OSP、Nickel Pd Au M.in Hole Size?.75MM...
2
hdi-pcb
Specification: 500MM X 630MM
Detail: ?0.4 mm BGA pitch solutions ?Double sided ?Multilayer 1~36 ?Microvia & ELIC (Any layer technology) ?Laser Direct Imaging (LDI)/Direct Imaging (DI) ?Via Filling Technology (VIPPO & Cu Filling) ?Coins Technol...
3
multi-layer pcb
Specification: 500MM X 630MM
Detail: ?BGA pitch solutions:0.4 mm ?Layers: 1~36 ?Microvia & ELIC (Any layer technology) ?Laser Direct Imaging (LDI)/Direct Imaging (DI) ?Via Filling Technology (VIPPO & Cu Filling) ?Min width/***ce?.5/2.5MIL ...
4
double-side pcb
Specification: 500MM X 630MM
Detail: •Laminates TYPE:FR1、FR2?2F?HB、CEM-1、CEM-3、FR4 •Laminates:Nan Ya 、Matsushita 、Chang Chun、ShengYi •Min width/***ce?.10 MM •Finished Thickness?.4-1.6MM •Tolerance hole:2 mil •Max Size?00...
5
printed circuit board
Specification: 500MM X 630MM
Detail: •Laminates TYPE:FR1、FR2?2F?HB、CEM-1、CEM-3、FR4 •Laminates:Nan Ya 、Matsushita 、Chang Chun、ShengYi •Min width/***ce?.10 MM •Finished Thickness?.4-1.6MM •Tolerance hole:2 mil •Max Size?00...
Showing 1 - 5 of 5, total 1 pages [First] [Previous] [Next] [Last]
1
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Tel : 8675533592868 Fax : 8675533592869
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